万博集团仪器设备站 · 专业测试测量仪器授权供应商
国仪量子将扫描电镜（SEM）与聚焦离子束（FIB）整合为“黄金组合”，为 PCB 工艺优化、可靠性验证与失效根因判定提供关键支撑。
本文为国仪量子英文官网应用方案的中文概述：扫描电镜以高分辨电子束观察 PCB 表面微观形貌并配合 EDS 做微区元素分析，聚焦离子束以纳米精度对缺陷位置做截面切割，二者结合可完成从表面形貌到内部结构的 PCB 失效分析。以下为英文原文正文。
CIQTEK brings SEM and FIB together as a powerful team, providing critical support for PCB process optimization, reliability verification, and root cause determination of failures.
The SEM uses a high-resolution electron beam to capture crisp images of PCB surface morphology. It reveals solder pad plating, intermetallic compounds, micro-cracks, tin whiskers, and foreign particle contamination with exceptional clarity. Coupled with energy-dispersive X-ray spectroscopy (EDS), the SEM also performs elemental analysis on microscopic regions. This combination lets engineers identify the chemical signature of defects, making it straightforward to spot issues like short circuits, open circuits, corrosion, and plating anomalies.
While the SEM excels at surface imaging, the FIB takes over when you need to see what is happening inside the board. Using a nanometer-precision ion beam, the FIB performs targeted cross-sectioning at the exact defect location. It prepares ultra-thin slices through multi-layer boards, blind vias, and buried vias, exposing internal structures that mechanical sectioning simply cannot reach. Think of the FIB as a microscopic surgical tool: it removes material with nanometer accuracy, leaving a clean cross-section ready for imaging and analysis.
